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  high current, high power operational amplifier features  high output current: 10a peak  wide power supply range: 10v to 40v  low quiescent current: 2.6ma  isolated case to-3 package applications  motor driver  servo amplifier  valve actuator  syncro driver  programmable power supply description the opa501 is a high output current operational amplifier. it can be used in virtually all common op amp circuits, yet is capable of output currents up to 10a. power-supply voltages up to 40v allow very high output power for driving motors or other electromechanical loads. safe operating area is fully specified, and user-set current limits provide protection for both the amplifier and load. the class-b (zero output stage bias) provides low quiescent current during small-signal conditions. this rugged hybrid integrated circuit is packaged in a metal 8-pin to-3 package and is specified over the industrial temperature range of ?0 c to +85 c . v+ 4 5 output 3 r cl r cl + 2 +output drive 8 output drive 1 current sense v 6 sbos136a january 1983 revised december 2003 www.ti.com production data information is current as of publication date. products conform to specifications per the terms of texas instruments standard warranty. production processing does not necessarily include testing of all parameters. copyright ? 1983-2003, texas instruments incorporated please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. all trademarks are the property of their respective owners. opa501
opa501 2 sbos136a www.ti.com absolute maximum ratings power supply voltage (v s ) ................................................................ 40v power dissipation at +25 c (1, 2) .......................................................... 79w differential input voltage .............................................................. v s 3v common-mode input voltage .............................................................. v s operating temperature range ....................................... 55 c to +125 c storage temperature range .......................................... 65 c to +150 c lead temperature (soldering, 10s) ............................................... +300 c junction temperature .................................................................... +200 c output short-circuit duration (3) ............................................... continuous notes: (1) at case temperature of +25 c. derate at 2.2 c/w above case temperature of +25 c. (2) average dissipation. (3) within safe operating area and with appropriate derating. connection diagram top view 1 2 3 7 8 5 6 +output drive nc output drive current sense v in +in v+ 4 r sc + r sc v o package/ordering information for the most current package and ordering information, see the package option addendum located at the end of this data sheet.
opa501 3 sbos136a www.ti.com OPA501AM parameter conditions min typ max units rated output (1, 2) output current r l = 2 ? 10 a continuous (3) r l = 2.6 ? 10 a output voltage (3) i o = 10a peak 20 23 v dynamic response bandwidth, unity gain small signal 1 mhz full power bandwidth v o = 40v pp , r l = 8 ? 10 16 khz slew rate r l = 5 ? 1.35 v/ s r l = 6.5 ? 1.35 v/ s input offset voltage initial offset 5 10 mv vs temperature 25 c < t < +85 c 10 65 v/ c vs supply voltage 35 v/v input bias current initial t case = +25 c1540na vs temperature 0.05 na/ c vs supply voltage 0.02 na/v input difference current initial t case = +25 c 5 10 na vs temperature 25 c < t < +85 c 0.01 na/ c open-loop gain, dc r l = 5 ? 94 115 db r l = 6.5 ? 98 115 db input impedance differential 10 m ? common-mode 250 m ? input noise voltage noise f n = 0.3hz to 10hz 3 v pp f n = 10hz to 10khz 5 vrms current noise f n = 0.3hz to 10hz 20 pa pp f n = 10hz to 10khz 4.5 parms input voltage range common-mode voltage (4) linear operation (|v s | 6) (|v s | 3) v common-mode rejection f = dc, v cm = (|v s | 6) 70 110 db power supply rated voltage 28 v operating voltage range 10 36 v current, quiescent 2.6 10 ma temperature range case specification 25 +85 c operating, derated performance 55 +125 c storage 65 +150 c thermal resistance steady state jc 2.0 2.2 c/w notes: (1) package must be derated based on a junction-to-case thermal resistance of 2.2 c/w or a junction-to-ambient thermal resistance of 30 c/w. (2) safe operating area and power derating curves must be observed. (3) with r sc = 0. peak output current is typically greater than 10a if duty cycle and pulse width limitations are observed. output current greater than 10a is not guaranteed. (4) the absolute maximum voltage is 3v less than s upply voltage. electrical characteristics at t c = +25 c, and v s = 28v, unless otherwise noted.
opa501 4 sbos136a www.ti.com typical characteristics typical at +25 c case and v s = 28vdc, unless otherwise noted. open-loop frequency response 120 1 frequency (hz) amplitude (db) 10 100 1k 10k 100k 1m 10m 100 80 60 40 20 0 20 0 30 60 90 120 150 180 210 phase (degree) amplitude phase common mode rejection vs frequency frequency (hz) common-mode rejection (db) 120 100 80 60 40 20 0 1 10 100 1k 10k 100k 1m input bias current vs temperature case temperature ( c) input bias current (normalized) 2.8 50 25 0 25 50 75 100 125 2.4 2.0 1.6 1.2 0.8 0.4 0 output voltage swing vs power supply voltage power supply voltage, v s (v) output voltage (vpk) 40 10 35 30 25 20 15 10 15 20 25 30 35 40 a v = 10 i o = 1a i o = 5a i o = 10a full power response frequency (khz) output voltage swing (vp-p) 100 1 2 4 6 10 20 40 60 60 40 20 10 6 4 2 100 +v s = 34v +v s = 28v maximum output maximum undistorted sine wave output r l = 8 a v = +10 t c = +25 c ? harmonic distortion vs frequency frequency (khz) total harmonic distortion (%) 1.8 10 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 10 2 10 3 10 4 v o = 40vp-p a v = +10 v s = 28v r l = 4 ? r l = 8 ? r l = 16 ? r l = 50 ?
opa501 5 sbos136a www.ti.com typical characteristics (cont.) typical at +25 c case and v s = 28vdc, unless otherwise noted. pulse response, a v = +1 time (10 s/div) input/output voltage (5v/div) pulse response, a v = +1 time (100 s/div) input/output voltage (5v/div) power derating curve case temperature ( c) internal power dissipation, p d (w) 120 0 100 80 60 40 20 0 25 50 75 100 125 150 jc = 2.2 c/w current limit resistor vs limit current limit current (a) current limit resistor, r sc ( ? ) 0.28 02468101214 0.24 0.20 0.16 0.12 0.08 0.04 0 t c = +25 c current limit vs temperature case temperature ( c) short circuit current (a) 7 50 25 0 25 50 75 100 125 6 5 4 3 2 1 0 r sc = 0.12 ? r sc = 0.28 ? normalized thermal resistance vs frequency frequency (hz) normalized ( jc ) 1.2 1.0 0.8 0.6 0.4 0.2 0 0.1 1 10 100 1k 10k
opa501 6 sbos136a www.ti.com current limits the opa501 has independent positive and negative current limit circuits. current limits are set by the value of r + sc and r sc . the approximate value of these resistors is: i limit is the desired maximum current at room temperature in amperes and r sc is in ohms. the current limit value de- creases with increasing temperature?ee typical perfor- mance curves. the current limit resistors conduct the full amplifier output current. power dissipation of the current limit resistors at maximum current is: the current limit resistors can be chosen from a variety of types. most wire-wound types are satisfactory, although some physically large resistors may have excessive induc- tance which can cause instability. safe operating area stress on the output transistor is determined by the output current and the voltage across the conducting output transis- tor. the power dissipated by the output transistor is equal to the product of the output current and the voltage across the conducting transistor, v ce . the safe operating area (soa), applications information grounding techniques can greatly affect the performance of a power op amp. figure 1 shows grounds connected so that load current does not flow through signal ground connec- tions. power supply and load connections should be physi- cally separated from the amplifier input and signal connec- tions. power supply connections to the amplifier should be by- passed with 10 f tantalum capacitors connected close to the device pins. the capacitors should be connected to load ground as shown. figure 2, shows the permissible range of voltage and cur- rent. soa is reduced at high operating temperature?ee figure 3. the safe output current decreases as v ce increases. output short-circuits are very demanding. a short-circuit to ground forces the full power supply voltage (positive or negative side) across the conducting transistor. with v s = 30v, the current limit must be set for 2a to be safe for short-circuit to ground. for further information on soa and evaluating signal and load conditions, consult applications bulletin ab-039. heat sinking most applications require a heat sink to assure that the maximum junction temperature of 200 c is not exceeded. the size of the heat sink required depends on the power dissipated by the amplifier and ambient temperature condi- tions. application bulletin ab-039 explains how to find maximum power dissipation for dc, ac, reactive loads, and other conditions. applications bulletin ab-038 shows how to determine heat sink requirements. the case of the opa501 is isolated from all circuitry and can be fastened directly to a heat sink. this eliminates cumber- some insulating hardware that degrades thermal perfor- mance. see applications bulletin ab-037 for information on mounting techniques and procedures. figure 3. transistor safe operating area at +125 c case temperature. figure 1. basic circuit connections. figure 2. transistor safe operating area at +25 c case temperature. p max = (i limit ) 2 r sc 1 2 4 6 10 20 40 60 80 10 4 2 1.0 0.8 0.6 0.4 0.2 0.1 output current (a) voltage across output transistor (v) 8 6 100 maximum specified current 8 t case = +25 c t junction = +200 c jc = 2.2 c/w 1ms 0.5ms maximum specified voltage rm, am sm, bm 5ms dc power dissipation limit second breakdown limit 1 2 4 6 10 20 40 60 80 10 4 2 1.0 0.8 0.6 0.4 0.2 0.1 output current (a) voltage across output transistor (v) 8 6 100 maximum specified current 8 t case = +125 c t junction = +200 c jc = 2.2 c/w 0.5ms 1ms maximum specified voltage rm, am sm, bm 5ms dc + (1) + (1) opa501 r sc r sc + r 2 r 1 v in v v+ g = 1 + r 2 r 1 note: (1) 10f tantalum. load r sc = 0.65 i limit ? 0. 0437 ?
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) OPA501AM nrnd to-3 lmf 8 tbd call ti call ti (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 2-feb-2009 addendum-page 1
mechanical data mmbc005 ? april 2001 1 post office box 655303 ? dallas, texas 75265 lmf (o?mbcy?w8) metal cylindrical package 4202491/a 03/01 1.510 (38,35) 1.550 (39,37) 0.745 (18,92) 0.770 (19,56) ? 0.038 (0,97) 0.042 (1,07) ? 0.105 (2,67) 0.080 (2,03) 0.260 (6,60) 0.300 (7,62) 0.400 (10,16) 0.500 (12,70) 1.192 (30,28) 1.182 (30,02) 0.591 (15,01) 0.596 (15,14) 0.980 (24,89) 1.020 (25,91) 0.151 (3,84) 0.161 (4,09) ? ? 0.500 (12,70) seating plane 1 2 3 4 5 6 7 8 40 notes: a. all linear dimensions are in inches (millimeters). b. this drawing is subject to change without notice. c. leads in true position within 0.010 (0,25) r @ mmc at seating plane. d. pin numbers shown for reference only. numbers may not be marked on package.
important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti?s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti?s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers are responsible for their products and applications using ti components. to minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any ti patent right, copyright, mask work right, or other ti intellectual property right relating to any combination, machine, or process in which ti products or services are used. information published by ti regarding third-party products or services does not constitute a license from ti to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of ti information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. reproduction of this information with alteration is an unfair and deceptive business practice. ti is not responsible or liable for such altered documentation. information of third parties may be subject to additional restrictions. resale of ti products or services with statements different from or beyond the parameters stated by ti for that product or service voids all express and any implied warranties for the associated ti product or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. ti products are not authorized for use in safety-critical applications (such as life support) where a failure of the ti product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of ti products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by ti. further, buyers must fully indemnify ti and its representatives against any damages arising out of the use of ti products in such safety-critical applications. ti products are neither designed nor intended for use in military/aerospace applications or environments unless the ti products are specifically designated by ti as military-grade or "enhanced plastic." only products designated by ti as military-grade meet military specifications. buyers acknowledge and agree that any such use of ti products which ti has not designated as military-grade is solely at the buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. ti products are neither designed nor intended for use in automotive applications or environments unless the specific ti products are designated by ti as compliant with iso/ts 16949 requirements. buyers acknowledge and agree that, if they use any non-designated products in automotive applications, ti will not be responsible for any failure to meet such requirements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications amplifiers amplifier.ti.com audio www.ti.com/audio data converters dataconverter.ti.com automotive www.ti.com/automotive dlp? products www.dlp.com broadband www.ti.com/broadband dsp dsp.ti.com digital control www.ti.com/digitalcontrol clocks and timers www.ti.com/clocks medical www.ti.com/medical interface interface.ti.com military www.ti.com/military logic logic.ti.com optical networking www.ti.com/opticalnetwork power mgmt power.ti.com security www.ti.com/security microcontrollers microcontroller.ti.com telephony www.ti.com/telephony rfid www.ti-rfid.com video & imaging www.ti.com/video rf/if and zigbee? solutions www.ti.com/lprf wireless www.ti.com/wireless mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2009, texas instruments incorporated


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